IRF6665 |
RFQ for IRF6665 Required Field |
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| Technical/Catalog Information | IRF6665TR1PBF |
| Vendor | International Rectifier (VA) |
| Category | Discrete Semiconductor Products |
| Mounting Type | Surface Mount |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 100V |
| Current - Continuous Drain (Id) @ 25° C | 4.2A |
| Rds On (Max) @ Id, Vgs | 62 mOhm @ 5A, 10V |
| Input Capacitance (Ciss) @ Vds | 530pF @ 25V |
| Power - Max | 2.2W |
| Packaging | Cut Tape (CT) |
| Gate Charge (Qg) @ Vgs | 13nC @ 10V |
| Package / Case | DirectFET? Isometric SH |
| FET Feature | Standard |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IRF6665TR1PBF IRF6665TR1PBF IRF6665TR1PBFCT ND IRF6665TR1PBFCTND IRF6665TR1PBFCT |
| Product | Manufacturers | Pack | D/C | |||||||||||||||||||
| IRF6665 | - | 5 |
This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area. Furthermore, gate charge, body-diode reverse recovery and internal gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD, and EMI.
The IRF6665 device utilizes DirectFET TM packaging technology. DirectFET TM packaging technology offers lower parasitic inductance and resistance when compared to conventional wirebonded SOIC packaging. Lower inductance improves EMI performance by reducing the voltage ringing that accompanies fast current transients. The DirectFET TM package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing method and processes. The DirectFET TM package also allows dual sided cooling to maximize thermal transfer in power systems, improving thermal resistance and power dissipation. These features combine to make this MOSFET a highly efficient, robust and reliable device for Class-D audio amplifier applications.
Features |
| • Latest MOSFET Silicon technology• Key parameters optimized for Class-D audio amplifier applications• Low RDS(on) for improved efficiency• Low Qg for better THD and improved efficiency• Low Qrr for better THD and lower EMI• Low package stray inductance for reduced ringing and lower EMI• Can deliver up to 100W per channel into 8 with no heatsink • Dual sided cooling compatible• Compatible with existing surface mount technologies•Lead and Bromide Free |
| Parameter | Max. | Units | |
| VDS | Drain-Source Voltage | 100 | V |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 19 | A |
| ID @ TA = 25°C | Continuous Drain Current, VGS @ 10V | 4.2 | A |
| ID @ TA = 100°C | Continuous Drain Current, VGS @ 10V | 3.4 | A |
| IDM | Pulsed Drain Current | 34 | A |
| PD @TC = 25°C | Maximum Power Dissipation | 42 | W |
| PD @TA = 25°C | Power Dissipation | 2.2 | W |
| PD @TA = 100°C | Power Dissipation | 1.4 | W |
| Linear Derating Factor | 0.017 | mW/°C | |
| VGS | Gate-to-Source Voltage | ± 20 | V |
| TJ , TSTG | Junction and Storage Temperature Range | -55 to + 175 | °C |
